Hlau 3D luam ntawv daim ntawv thov nyob rau hauv lub semiconductor kev lag luam tsom rau cov khoom uas yuav tsum tau siab precision, siab complexity, thiab siab huv. Nws tuaj yeem daws cov ntsiab lus mob uas ib txwm muaj kev tsim tawm tsis tuaj yeem ua tiav, xws li kev sib xyaw ua ke thiab cov txheej txheem ntws ncaj qha. Nws feem ntau suav nrog plaub qhov xwm txheej tseem ceeb. Hauv kev lag luam uas nanometer- teev qhov tseeb, ultra- ib puag ncig huv si, thiab thermal stability ncaj qha txiav txim siab cov txiaj ntsig thiab kev ua haujlwm ntawm cov cuab yeej, kev tsim khoom ntxiv muaj kev ywj pheej tsim uas cov pa machining, casting, lossis vuam tsuas tuaj yeem sib phim. Los ntawm kev ua kom cov khoom siv monolithic nrog cov yam ntxwv sab hauv, topology- optimized geometries, thiab cov khoom siv kho kom haum rau cov txheej txheem tshwj xeeb, hlau 3D luam ntawv tsis tu ncua los ntawm prototyping mus rau cov cuab yeej tsim nyog thiab cov txheej txheem tseem ceeb.
High-Cov cuab yeej Precision thiab Fixtures
Wafer txheej txheem Fixtures
Nqus clamping fixtures rau wafer tu, etching, thiab photolithography txheej txheem . 3D luam ntawv enables kev molding ntawm cov qauv clamping yam tsis muaj splicing qhov khoob, tsis txhob muaj av tsub zuj zuj nyob rau hauv cov tsoos spliced fixtures, raws li particle tswj raws li ISO 14644-1 semiconductor cleanrooms. Cov khoom siv: oxygen-dawb tooj liab (siab thermal conductivity), 6061 aluminium alloy (lub teeb yuag), lossis cov hlau tsis muaj hlau nplaum.
Cov khoom siv no yuav tsum tswj xyuas qhov chaw wafer kom meej thaum uas tsis muaj cov khoom seem - tsim cov seams lossis cov khoom seem. Cov ntawv luam tawm sib xyaw ua ke tshem tawm cov kab mob me me uas muaj nyob hauv ntau- cov khoom sib dhos, txo qhov kev pheej hmoo ntawm kev sib kis uas tuaj yeem ua rau muaj qhov tsis xws luag ntawm cov kab mob siab heev. Oxygen- tooj liab dawb yog nyiam qhov twg yuav tsum tau hloov cov cua kub ceev kom ruaj khov wafer kub thaum lub sij hawm aggressive ntub cleans los yog plasma raug; 6061 aluminium txo qhov hnyav rau siab -ceev tuav robots; thiab tsis yog- cov hlau tsis muaj hlau nplaum tiv thaiv kev cuam tshuam nrog cov hlau nplaum sib nqus lossis electrostatic teb hauv cov txheej txheem chamber. Nto tiav tom qab polishing ib txwm ncav cuag Ra qhov tseem ceeb tsawg txaus kom txaus siab rau Chav Kawm 1–Class 10 cleanroom particle budgets.
Customized electrostatic chuck bases, uas tuaj yeem ua ke nrog cov khoom siv hluav taws xob sab hauv thiab cov cua txias, txhim kho wafer adsorption stability thiab thermal uniformity thaum lub sij hawm txheej txheem, txo wafer warpage.
Electrostatic chucks (ESCs) yog qhov tseem ceeb rau kev tuav wafers tiaj tus hauv lub tshuab nqus tsev thiab lub zog RF siab. Los ntawm kev luam ntawv electrode grooves thiab conformal txias passages nyob rau hauv ib tug ib thooj, manufacturers ua tiav ntau uniform clamping quab yuam thiab tighter kub tswj nyob rau hauv lub wafer nto. Qhov no txo cov kev ntxhov siab hauv zos thiab hneev nti, uas yog qhov tshwj xeeb tshaj yog muaj txiaj ntsig rau nyias lossis loj - txoj kab uas hla wafers siv nyob rau hauv siab heev logic thiab nco fabrication. Lub peev xwm los tso cov cua txias tsuas yog micrometers los ntawm wafer qhov chaw sib txuas ntxiv luv luv thermal teb lub sij hawm piv nrog cov qauv siv tshuab ESCs uas vam khom los yog cov kab sib txuas.
Semiconductor Testing thiab Ntim Fixtures
Kev sojntsuam chaw nres tsheb fixtures thiab hlawv-nyob rau hauv lub qhov (socket) xeem rau kev xeem nti. Ua kom muaj kev sib xyaw ua ke ntawm cov txheej txheem sojntsuam, kom ntseeg tau qhov kev sojntsuam qhov tseeb ntawm ± 0.005 mm qib, tsim nyog rau siab - ntim ntim ntim cov khoom xav tau.
Raws li kev ntim ntim nce ntxiv nrog 2.5D thiab 3D kev sib koom ua ke, cov ntawv sojntsuam thiab cov qhov (sockets) yuav tsum tswj hwm micron - theem qhov tseeb ntawm ntau txhiab tus ntsiab lus. Hlau additive manufacturing tso cai rau tag nrho cov kev sojntsuam array txhawb cov qauv luam tawm raws li ib tug nruj lub cev, minimizing cumulative kam rau ua pawg-ups uas tshwm sim thaum discrete qhov chaw sib dhos. Cov kev sib tw ua tau zoo xa cov kev sib tiv tauj zoo sib xws thiab kev ua haujlwm hluav taws xob ntau dua txhiab tus touchdowns, txhawb nqa siab - dhau los ntawm kev sim ntawm cov khoom siv zoo - suab.
Vuam lub taub hau hauv paus rau flip-chip thiab xaim sib txuas, nrog rau siab rigidity thiab hnav tsis kam, txo kev sib raug zoo offset tus nqi thiab txhim kho cov khoom ntim.
Cov cuab yeej Bonding muaj kev rov ua dua txhua yam thiab thermal cycling. Cov ntaub ntawv luam tawm tau tsim los ntawm cov cuab yeej hardenable steels lossis cobalt-chromium alloys muab cov tawv tawv uas xav tau los khaws cov lus qhia sib txuas ntawm lub hom phiaj thaum tiv thaiv kev hnav los ntawm ultrasonic zog thiab rov sib cuag. Integrated cooling nta kuj tuaj yeem muab ntxiv kom ruaj khov ntawm qhov sib cuam tshuam ntawm daim ntawv cog lus, ntxiv kev txhim kho cov txheej txheem qhov rai thiab ua ntej - kis tawm.
Thermal Management Core Cheebtsam
Integrated heat sinks rau RF fais fab khoom siv thiab IGBT modules. Muaj peev xwm luam tawm cov qauv nrog ua - nyob rau hauv kauv lossis lattice cua txias raws uas tuaj yeem haum ncaj qha rau saum npoo ntawm cov khoom cua sov. Piv nrog rau cov txheej txheem drilled raws li ib txwm muaj, thermal kuj tuaj yeem txo los ntawm 20% -40%, yam tsis muaj kev tiv thaiv thermal ntxiv los ntawm cov pob qij txha.
Cov khoom siv fais fab hauv RF amplifiers, lub cev muaj zog tsav, thiab lub zog hluav taws xob ua kom muaj cua sov hauv cheeb tsam. Pa cua kub dab dej cia siab rau cov drilled channels los yog bonded fin pawg uas qhia interfaces thiab geometric txwv. Kev tsim khoom siv ntxiv muab cov dej txias tso ncaj qha rau ntawm qhov tuag txuas rau hauv qhov zoo tshaj plaws kauv, tus pin-fin, lossis cov qauv lattice, ua kom thaj tsam loj tshaj plaws thiab txo qhov ntev ntawm txoj kev. Qhov tsis muaj braze lossis weld pob qij txha tshem tawm cov teeb meem thermal thiab cov ntsiab lus xau, ua rau txo qis hauv tag nrho cov thermal kuj. Cov txiaj ntsig zoo no txhais ua lub zog siab dua, lub neej ntev ntawm cov cuab yeej siv, thiab ntau cov qauv tsim qauv.
Precision txias puag rau lithography tshuab thiab etching khoom. Pab kom tsim cov kab tsis sib xws ntawm qhov chaw nkhaus, ua tau raws siab - qhov kev xav tau ntawm kev tswj qhov kub thiab txias, tsis txhob thermal deformation cuam tshuam rau cov qauv raug thaum ua wafer.
Nyob rau hauv huab -ultraviolet (EUV) lithography thiab cov cuab yeej etch siab heev, txawm tias sub-degree kub gradients tuaj yeem hloov qhov loj me lossis ua rau overlay yuam kev. Cov ntawv luam ntawv txias ua raws li qhov tseeb contour ntawm optical lossis chamber Cheebtsam, xa cov khoom siv hluav taws xob sib txawv uas nws xav tau tshaj plaws. Qhov ua tau zoo thermal stability pab tswj cov nanometer-theem mechanical thiab optical precision yuav tsum tau ua rau -ntug nodes.
Integrated Precision Structural Parts
End effectors thiab sib koom caj npab ntawm wafer hloov neeg hlau. 3D luam ntawv ua rau kev sib koom ua ke ntawm cov qauv hollow thiab siab -precision sib dhos datums, txo cov kev sib dhos yuam kev, txhim kho cov lus tsa suab thiab cov khoom siv lub neej.
Wafer- tuav cov neeg hlau yuav tsum sib txuas cov siab nruj nrog cov huab hwm coj tsawg kom ua tiav sai, kev vibration- dawb txav hauv qhov chaw nqus tsev. Topology- optimized lattice lossis hollow printed caj npab txo inertia thaum khaws cia rigidity. Integrated datum nto thiab mounting nta tshem tawm qhov yuav tsum tau rau theem nrab kev sib raug zoo ntawm ntau yam machined daim, zawm positional repeatability thiab ncua bearing thiab actuator lub neej los ntawm kev txo dynamic loads.
Tshwj xeeb -puab flanges thiab cov kav dej sib txuas rau lub tshuab nqus tsev. Ua kom muaj kev sib koom ua ke ntawm cov kev sib tshuam ntawm kev sib tshuam, zam kev pheej hmoo los ntawm kev siv vuam ib txwm, ua tau raws li ultra- lub tshuab nqus tsev siab ntawm 10^{-9} Torr rau cov tshuab nqus tsev semiconductor.
Ultra- siab- lub tshuab nqus tsev tsis muaj qhov sib txuas tau. Ntau -axis luam tawm flanges thiab fittings tuaj yeem suav nrog riam- ntug cov ntsaws ruaj ruaj, cov chaw nres nkoj nyuaj, thiab txoj hauv kev ntws sab hauv hauv ib qho sib txuas ntawm cov hlau, tshem cov weld seams uas yog ib qho chaw ntawm virtual leaks lossis outgassing. Kev tshaj tawm kom raug-kev ua tiav thiab kev kuaj pom kom ntseeg tau tias cov khoom no muaj kev ntseeg siab tuav 10^{-9} Torr lossis zoo dua.
Tshwj xeeb muaj nuj nqi Cheebtsam
Electrode Cheebtsam rau ion implantation thiab plasma etching khoom. Luam tawm nrog siab -kub thiab corrosion- cov ntaub ntawv tiv taus xws li tungsten thiab molybdenum, ua kom cov plasma complex confinement qauv tsim, haum rau hnyav plasma etching ib puag ncig.
Plasma-fab electrodes yuav tsum muaj sia nyob ion bombardment, tshuaj tua kab mob, thiab thermal cycling thaum tswj xyuas qhov tseeb geometric tswj ntawm plasma sheath. Cov hlau refractory xws li tungsten thiab molybdenum, ib txwm nyuaj rau tshuab rau hauv cov duab nyuaj, tuaj yeem luam tawm rau hauv cov kab sib txuas sib txuas, Faraday shields, lossis da dej taub hau electrodes. Qhov tshwm sim ua ke ua ke cov khoom siv uas yuav tsum tau ua nrog kev ua kom zoo ntshav plasma-fab geometry uas txhim kho cov txheej txheem sib xws thiab cov khoom siv lub neej.
Tshwj xeeb -zoo li tus solder nozzles rau semiconductor ntim. Ua kom muaj siab - qhov tseeb qhov hluav taws xob qhov hluav taws xob qhov hluav taws xob arrays thiab sab hauv channel tsim, haum rau siab - ntom micro- solder sib koom ntim xav tau, txhim kho kev ntim khoom thiab kev sib koom ua ke.
Fine-pitch flip-chip thiab cov txheej txheem ntim qib siab xav tau cov nozzles uas xa cov khoom siv sib xws los ntawm ntau ntau lossis ntau pua ntawm qhov sib txawv ntawm qhov sib txawv. Kev tsim khoom siv ntxiv ua rau ntau yam -orifice cov lus qhia nrog cov khoom siv sab hauv uas sib npaug sib npaug, txo qhov kev hloov pauv hauv qhov sib koom ua ke qhov siab thiab ntim thoob plaws cov array thiab ua kom muaj kev nkag siab dua nrog cov txheej txheem tsawg dua.
Kev Kho Kom Haum Kev Lag Luam Kev Lag Luam thiab Tom Qab- Kev Ua Haujlwm
Kev xaiv cov khoom siv yuav tsum ua kom tau raws li kev ua haujlwm huv ntawm semiconductor kev huv thiab kev ua raws cai, ua ntej uas tsis yog -magnetic, low- cov ntaub ntawv hlau tsis muaj zog uas ua tau raws li ROHS thiab SEMI S2 cov qauv.
Txhua yam khoom siv nkag mus rau hauv fab yuav tsum tsis txhob dhau los ua qhov chaw ntawm cov kab mob sib nqus, sib nqus cuam tshuam, lossis outgassing. Kev pom zoo alloys yog li tshuaj xyuas rau magnetic permeability, residual impurity theem, thiab compatibility nrog SEMI S2 ib puag ncig, kev noj qab haus huv, thiab kev nyab xeeb cov txheej txheem raws li zoo raws li ROHS txwv rau tej yam khoom muaj teeb meem.
Tom qab luam ntawv, cov txheej txheem xws li debinding, sintering, sandblasting, precision polishing, thiab ultrasonic tu yuav tsum tau tshem tawm cov residual hmoov nyob rau hauv lub pores thiab deg kab mob. Helium huab hwm coj spectrometry leak detection yog siv los xyuas kom meej sealing, kom ua raws li cov semiconductor rhiav kev huv huv.
Post{0}}kev ua haujlwm tseem ceeb npaum li cov kauj ruam luam ntawv nws tus kheej. Cov hmoov seem uas nyob rau hauv cov channel sab hauv lossis qhov chaw roughness uas tuaj yeem tso cov khoom yuav tsum raug tshem tawm. Kev tu kom zoo, kev ua tiav ntawm qhov chaw, thiab kev soj ntsuam nruj nruj kom paub tseeb tias txhua qhov ua tau raws li cov khoom siv, kev tawm, thiab lub tshuab nqus tsev cov qauv ntawm cov chav tsev niaj hnub semiconductor ua ntej nws tso tawm rau kev siv.
Sib koom ua ke, cov ntawv thov no qhia txog qhov kev tsim cov khoom siv hlau ua li cas hais txog kev lag luam semiconductor qhov xav tau tshaj plaws rau kev txiav txim siab, qhov nyuaj, kev huv, thiab kev ua haujlwm thermal. Raws li cov txheej txheem tsim nyog cov ntaub ntawv khaws cia thiab hmoov cov saw hlau loj, cov thev naus laus zis yuav tsum nthuav dav ntxiv rau hauv kev tsim khoom- cov khoom siv tseem ceeb, txhawb kev tsav tsheb mus rau qhov me me, cov txiaj ntsig siab dua, thiab kev tsim khoom zoo dua.
